Synthetic Graphite for Semiconductor Industry
Carbon & Graphite Products For Hot Zone
Components used in semiconductor environment have high requirements for particle size. It not only needs the good physical properties of graphite materials, such as high temperature resistance, corrosion resistance and plasma resistance, but also high requirements for the purity and machining accuracy of graphite.
We use imported purification equipment of international well-known brands, which can extract the purity of graphite processed parts to 5-50PPM, and the ash content of specially ordered products can be less than 2PPM.
Specifications of Synthetic Graphite Materials:
Grade | Bulk Density | Specific Resistance | Flexural Strength | Compressive Strength | Ash
(Normal) |
Ash (purified) | Grain Size |
g/cm³ | μΩ.m | MPa | MPa | % | ppm | μm | |
IS-11 | 1.83 | 11~13 | 50 | 115 | 0.05 | 50 | 8~10 |
IS-12 | 1.90 | 11~13 | 61 | 135 | 0.05 | 50 | 8~10 |
IS-13 | 1.78 | ≤13 | 46 | 86 | 0.05 | 50 | – |
IS-14 | 1.86 | 11~12 | 65 | 135 | 0.05 | 50 | 5 |
IS-22 | 1.80 | 13~14 | 55 | 100 | 0.02 | – | 8 |
IS-23 | 1.86 | 9~12 | 55 | 110 | 0.05 | – | 13 |
IS-31 | 1.79 | 11-13 | 38 | 78 | 0.05 | – | – |
IS-32 | 1.85 | 11-13 | 45 | 100 | 0.05 | – | – |
Note: These are reference data, not guaranteed data.
Applications: graphite thermal field in semi-con single crystal furnace, including heating element, crucible, insulation cylinder, packaging fixture, etc.
Production Process
Raw material crushing | Screening | Premix and knead | CIP Molding |
Baking | Impregnation | Rebaking | Graphitization |
CNC Machining | Purification | inspection | packaging |